Summer 2008
Improve your PCBs with OM Nanofinish
In our last newsletter we introduced the Organic Metal Nanofinish, now available from Omni Graphics, and we discussed some of its basic properties. This month we'd like to show you how the OM Nanofinish can help you improve your PCBs and overcome some of the challenges and drawbacks of other finish options. Organic Metal Nanofinish is revolutionary technology, and we are proud to be the first PCB manufacturer in Canada to offer this option.
Omni Graphics will be hosting a booth at the EPTECH Show in
Richmond this Thursday, June 19 from 10am-5pm. Come by the Omni
Graphics booth to see samples and more information
about the OM Nanofinish. This year's show is at the Best
Western Richmond Hotel and Conference Centre. The location is
7551 Westminster Hwy., Richmond, BC. Please click here for Google
directions. For more information or to register online for faster
admittance, please go to http://www.ept.ca/eptech.asp.
If you are in the
electronics industry or work with electronics, EPTECH is a must-attend
event!
Best wishes,
Jac Kroeker
If you have an opinion or advice regarding this newsletter, please contact us via email at jac@omnigraph.com subject "newsletter".
OM Nanofinish: Making your PCBs Better
The Organic Metal Nanofinish offers a number of revolutionary improvements in printed circuit board manufacturing. Due to its physical properties it offers significant advantages over other finish types, most particularly ENIG as well as OSP.
Multiple Reflow Solderability - better than OSP
With the ROHS directive requiring lead-free solder, the temperatures for some reflow solder processes must increase to ensure consistent and reliable solder joints. Higher process temperatures can result in increased pure Sn loss, but the Organic Metal Nanofinish can withstand multiple reflows with better oxidation resistance. OM Nanofinish can stand 155°C / 4 hours like metallic finishes (OSP can not) and has a lower wetting angle than metallic finishes.
No "Black Pad" Risk - better than ENIG
Black pad is a problem endemic to ENIG (electroless nickel immersion gold) surface finish: a separation of solder joints formed to the surface of an electroless nickel underplate. This is commonly attributed to excessive phosphorous in the electroless nickel (i.e. nickel electroless bath out of control). However, any kind of nickel contamination (phosphorous or not) that results in the failures characterized here, are often reported as "black pad" failures. While Omni Graphics uses sophisticated testing to prevent "black pad" as much as possible in our ENIG finish, we are pleased to report that OM Nanofinish is a way for our clients to avoid black pad defects altogether.
Improved Appearance - better than OSP
OSP finishes can make the Cu surface appear darker and brownish in colour. The OM Nanofinish imparts a light, silvery appearance for a more attractive finished product. In recent tests, OM Nanofinish showed no discoloration after an 85°C/85% RH aging test.
Save Time and Money - better than ENIG
OM Nanofinish is a less expensive material than ENIG, which enables clients who choose OM Nanofinish to lower their PCB production costs. In today's market conditions of increasing costs and tight margins, the OM Nanofinish helps our clients be more competitive. As an added advantage, the processing time for OM Nanofinish is one day faster than ENIG, allowing for a quicker turn-around of orders.
Other Benefits:
- The OM Nanofinish resists scratches, and resists oxidation even if there is a scratch.
- Time between assembly steps is not a problem. With the OM Nanofinish there is no deterioration of solderability.
- No micro voids. The OM Nanofinish provides a homogenous and reliable solder joint.
- Electrical tests can be done after finishing.
For more information...
If you are interested in learning more, please contact Jac
Kroeker by phone (604-276-9717) or email jac@omnigraph.com.
© 2008 Omni Graphics Ltd.Back to Newsletter Index.